VISUAL INSPECTION UNDERNEATH BGA’S WITH ERSASCOPE 2
Thursday, February 19th, 2009The Ersascope 2 under BGA inspection system has become well established as the industry leader for optically inspecting hidden solder joints under BGA’s and in other inaccessible places. It now comes as standard with a metal halide light source, giving a clear, crisp image of the solder joints underneath a BGA.
Different optical heads are supplied for looking under Flip chips, CSP’s, BGA’s and 0201 components.
Image processing software compares the view of the component currently being inspected with a vast library of images containing all known fault conditions. Using this powerful database it is a simple matter to identify faults and to establish what corrective action needs to be taken.
For more information see our Website or contact Paul Cooper on 07880 546380 or Keith Gummer on 07770 615405