Archive for August, 2009

SOLDER PASTE PRINTING (LOW VOLUME)

Friday, August 21st, 2009

A bench mounted semi automatic solder paste screen printer is available from Blundell Production Equipment Ltd.

The Fritsch SD903 has pneumatically controlled print pressure and will print onto PCB’s of up to 410 x 460mm. It has a magnetic base place for easy location of boards and is very easy to adjust and to operate.

It is ideal for short batch runs and Blundells can also supply a low volume pick and place machine and small reflow oven. For more information please contact Keith Gummer on 07770 615405 or Paul Cooper on 07880 546380 or call our office on 02476 210270. www.blundell.co.uk

ROBOTIC SOLDERING ADDED TO RANGE

Tuesday, August 18th, 2009

We at Blundell are very pleased to have been awarded the UK distribution of MTA’s factory automation products. This gives us the ability to offer in-turnkey production line solutions for robotic soldering and dispensing.  

MTA specialise in modular robots and automated compact work cells. One MTA product that will be of particular interest to our customer base will be their table top robotic soldering iron for automatic point to point soldering.

More information will follow shortly. For further details please call Paul or Neil Blundell on 02476 210270. www.blundell.co.uk

USED FLOWSOLDERING MACHINE

Thursday, August 13th, 2009

If you are looking for a reliable used flow soldering machine, we at Blundell have several factory reconditioned wave machines available for immediate delivery. Please call us on 02476 210270 for details.

DRYING AND CURING OVEN

Tuesday, August 11th, 2009

A range of ovens for drying, heating curing or storage is offered by us at Blundell Production Equipment Ltd (www.blundell.co.uk). These ovens  are mostly used in the electronics industry for drying or heating electronic assemblies to prevent them from retaining moisture, which can adverseley affect them during soldering.  

Operating temperatures are from 30 degrees to 220 degrees centigrade, with an option for up to 300 degrees.

These are convection ovens with fans that are adjustable for air flow. Wherever possible, printed circuit boards should be baked prior to soldering to avoid blow holes in the solder joints. Devices such as BGA’s also need to be heated to ensure that they do not contain moisture when they are soldered.

For more information please call Keith Gummer on 07770 615405 or Paul Cooper on 07880 546380, or call our office on 02476 210270.